Through Hole Plating

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Through Hole Plating / Metallization

Technology


Okuno-Auromex has been an innovator providing leading edge, and environmentally acceptable technology to the PCB industry.


Through Hole Plating

Through hole plating is typically accomplished by initially depositing a conductive material (e.g. electroless copper) in the PTH, or other features such as blind microvias, BMVs, which is typically followed by electroplated copper to increase conductive layer thickness.

The process of initial metallization requires specific surface preparation depending on the type of technology utilized for making the PTH conductive (e.g. electroless copper vs. conductive polymers).

Thus both desmear and other pretreatments must be specifically developed for each technology.

OPC metallization technology includes a full package of process chemicals for the pretreatment and electroless copper plating of PTHs and other PCB features. This includes surface cleaners, activation catalyst, acceleration chemicals and electroless copperplating processes. Our process is available for rigid boards.

Depending on catalyst types, OPC processes include acid catalyst process and alkali catalyst process.

The acid catalyst process is specifically used for subtractive process that generates a PCB with specific copper pattern by etching copper from a copper clad laminate.

Alternatively, the alkali catalyst process is mainly used for semi-additive process, where a pattern is plated onto bare laminate using electroless copper plating to generate the desired conductive pattern. The alkaline process is also utilized for the subtractive process.

OPC Acid Catalyst Products

Process

Product

Feature

Cleaning & Conditioning

OPC-370 Condiclean MA

PFOS and PFOA-free cleaner for PCBs. Has excellent in removing metallic oxide and dirts, such as oil or fingerprint on copper foil surface,
through hole and blinded via hole.

Soft Etching

OPC-465 Soft Etch

Hydrogen peroxide liquid etching agent.Provide economical operation.

OPC-480 Soft Etch

Persulphate powdery etching agent. Provide fine etching to copper surface.

Pre-Dipping

OPC-Sal M

Acidic powdery type dipping agent. Maintain the stability of catalyzing bath.

Catalyzing

OPC-80 Catalyzing

Acidic catalyzing of Pd-Sn colloid. Has excellent catalyzing effect and suitable for application to complicated substrate.

OPC-80 Catalyzing ML

Acidic catalyzing of Pd-Sn colloid. Has excellent bath stability and can be applied for a long period.

OPC-90 Catalyzing

Acidic catalyzing of Pd-Sn colloid. Developed for extending the bath life of accelerator.

Accelerating

OPC-505 Accelerator

Sulfuric base accelerator. Has excellent activating power of Pd catalyst and high acceptable limit of Sn.

OPC-555 Accelerator M

Fluoride base accelerator. Has high acceptable limit of Sn and can be applied for a long period.

Electroless Copper Plating

OPC-Copper FIS

EDTA type additive with cyanide-free. Provide high reliability with economical operation.

ATS Addcopper IW

Rochelle salt type additive with cyanide-free. Provide adhesion to substrate and enhance blister-free.

OPC Alkali Catalyst Processes

Process

Product

Feature

Cleaning & Conditioning

OPC-370 Condiclean MA

PFOS and PFOA-free cleaner for PCBs. Has excellent in removing metallic oxide and dirts, such as oil or fingerprint on copper foil surface,
through hole and blinded via hole.

Soft Etching

OPC-465 Soft Etch

Hydrogen peroxide liquid etching agent. Provide economical operation.

OPC-480 Soft Etch

Persulphate powdery etching agent. Provide fine etching to copper surface.

Pre-Dipping

OPC-Predip 49L

Pre-dipping agent for alkali process. Improve better adhesion of catalyst.

OPC-H TEC Predip

Pre-dipping agent for horizontal process.

Catalyzing

OPC-50 Inducer M

Alkali catalyzing agent that give Pd ion. Has excellent penetration effect that suit for small diameter holes.

OPC-H Tec Catalyst

Alkali catalyzing agent. Suitable for horizontal process.

Accelerating

OPC-150 Crystal RW

Weak alkali accelerator. Remove excessive Pd and improve deposition effect and adhesion of electroless copper plating.

OPC-H Tec Reducer

Accelerator for horizontal process.

Electroless Copper Plating

OPC-Copper FIS

EDTA type additive with cyanide-free. Provide high reliability with economical operation.

ATS Addcopper IW

Rochelle salt type additive with cyanide-free. Provide adhesion to substrate and enhance blister-free.


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